Material Characteristics and Chemical-Mechanical Polishing of Aluminum Alloy Thin Films
碩士 === 國立清華大學 === 材料科學與工程研究所 === 85 === The demands for manufacturing integrated circuit devices with high circuit speed and high packing density have driven the development of multilevel interconnection system. However, miniaturization of the circuits severely restricts the performance of the i...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12067094505883987717 |