The effects of residual solvent content, curing agent/ accelerator ratio, and hygrothermal aging on the curing behavior of the epoxy/dicyandiamide system.
碩士 === 元智工學院 === 化學工程學系 === 85 === The effects of specimens configurations, residual solvents, curingagent/accelerators ratios, and hygrothermal aging on the curing behaviors ofan epoxy (diglycidyl ether of bisphenol A) and dicyandiamide...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Online Access: | http://ndltd.ncl.edu.tw/handle/29283340088225782972 |