Stress and Deformation Analyses of IC Package Under Thermal Loads: Theoretical and FEM Studies
碩士 === 長庚大學 === 機械工程研究所 === 86 === ABSTRACT The plastic IC packages have gained acceptance and popularity in the electronics industry, especially in communication and computer electronics, due to the advantages of low cost and high mass production. The plastic packages have to pass stringent requi...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06816705363674099484 |