The Optimized Analysis for the Warpage of IC Packages
碩士 === 中原大學 === 機械工程研究所 === 86 === With the development of the semiconductive technology, IC plastic packages have become one of the most important manufacture industry. The IC packages are using thermosetting epoxy encapsulant to protect the chip from pollution and destruction. As IC packages be...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04101410689679169056 |