A Study of Thermally Stable In-Au Microjoints Prepared by Solid- Liquid Interdiffusion Bonding
碩士 === 國立中興大學 === 材料工程學研究所 === 86 === Indium and its alloys exhibit good service life and reliability, and are well suited for applications such as solder interconnections in electronic packaging. In this study, two types of Au-In microjoints, i.e. Au/In...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68652591054165627169 |