The Reflow Process and Properties of the Flip Chip Solder Bumps
碩士 === 國立成功大學 === 材料科學(工程)學系 === 86 === Abstract Flip chip has become interest to electronic package because of its gang bonding and high I/O capability. This present study investigated the flip chip solder bump produced by reflow proc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94986259003997714356 |