Prediction of Wire Profile in IC Packaging
碩士 === 國立成功大學 === 機械工程學系 === 86 === Wire-bonding process is one of the most important process in IC packaging.Through this process, the gold-wire connects die and leadfrane, and electronic signal pass through the gold-wire. Four factors are important in w...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86168332861357710768 |