Analysis of Heat Transfer and Thermal Stress of Wafers in Rapid Thermal Processing Furnaces
碩士 === 國立交通大學 === 機械工程研究所 === 86 === This surdy investigates heat transfer and thermal stress of wafer in a rapid thermal processing -type oven used for semiconductor processes. Thermal st11resses that are induced by temperature nonuniformity due to a heat loss at the edge of the wafer are ca...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82924718743983149496 |