= Flow analysis of reactive electronic packaging materials inside extrusion dies

博士 === 國立清華大學 === 化學工程研究所 === 86 ===

Bibliographic Details
Main Author: 潘金平
Other Authors: 劉大佼(Ta-Jo Liu)
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/85244174387787138311