An Electromagnetic Simulation for Interconnections of Multilayered Packaging:MCM's/PCB's
碩士 === 國立臺灣大學 === 電機工程學系研究所 === 86 === As the clock period of processor becomes shorter, interconnections of packages can not be treated as ideal short circuits or lumped circuits anymore. For the requirement of using transmission-line t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48662662796356123157 |