An Ivestigation of the Machining Parameters on Chemical-Mechanical Polishing Process
碩士 === 國立臺灣科技大學 === 機械工程技術研究所 === 86 === The purpose of this article is to discuss the feasibility of applying the Chemical-Mechanical Polishing (CMP) to the Ultra-Large Scale Integrated (ULSI) flatting process. This paper investigates some questions, i.e. the "Machining", "Process...
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| Format: | Others |
| Language: | zh-TW |
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1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15914111333839267671 |