Design and Analysis of Piezoresistive Stress Sensors for Microelectronic Packaging Technology
碩士 === 中正理工學院 === 電機工程研究所 === 87 === The purpose of this study is to utilize piezoresistors for package-induced stress measurement. The packaging process for microelectronic circuits can then be improved based on stress monitoring procedure. The feasibiliy of piezoresistive...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/95992239621596378472 |