Thermal Stress Measurements in Electronics Packages by Piezoresistive Stress Sensor
碩士 === 中正理工學院 === 電機工程研究所 === 87 === ABSTRACT The purpose of this article is quantitatively extracting the stress distribution in microelectronics packages through in-situ and non-destructive measurements. To this end, the P-type and N-type piezoresistive stress sensors were...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76763367609882783074 |