Studying and researching the strategies to improve the uniform temperature of rapid thermal processing
碩士 === 國立中正大學 === 化學工程研究所 === 87 === The thermal processing plays an important role of integrated circuit fabrication. It can not only supply the heat to make the chamber achieving high temperature, but utilize the thermal annealing process for removing the defects during processing. In r...
Main Authors: | Pi-ta Huang, 黃必達 |
---|---|
Other Authors: | F. S. Wang |
Format: | Others |
Language: | zh-TW |
Published: |
1999
|
Online Access: | http://ndltd.ncl.edu.tw/handle/71183727383971127487 |
Similar Items
-
A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing
by: Peng Huang, et al.
Published: (2018-09-01) -
Temperature Uniformity of the Wafer in Rapid Thermal Processing
by: Ming-Feng Hou, et al.
Published: (2003) -
Control Strategy for Thermal Budget and Temperature Uniformity in Spike Rapid Thermal Processing Systems
by: Wen-Chung Chen, et al.
Published: (2011) -
Studies of the Temperature Uniformity for 450mm Wafer in Rapid Thermal Process
by: Chien-ho Lai, et al.
Published: (2009) -
Control of Rapid Thermal Processor:Design for Better Temperature Uniformity
by: Huang, Yih-En, et al.
Published: (1997)