Thermal Deformation Analysis of PQFP and BGA Electronic Packages by Phase Shifting Moire Interferometry and Finite Element Method
碩士 === 國立中正大學 === 機械系 === 87 === The reliability of surface mounting electronic packaging such as PQFP and BGA could depend on a number of parameters that related to material, configuration, and manufacturing. One of the main factors led to failure is the coefficient of thermal expansion (CTE) misma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81689383661470517846 |