Thermalmachanics of Goldwire and Simulation of Thermosonic Wire Loop
碩士 === 國立中正大學 === 機械系 === 87 === Thermosonic Bonding is the commonly used technique in first level microelectronics packages. During the bonding process the wires are bonded or welded, one at a time, from the bond pad on a bare chip to a corresponding substrate. The final shape or profile of the wi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/30758768789202825065 |