Investigation of Thermosonic Wire Bonding in Microelectronics from a Viewpoint of Interfacial Phenomena
碩士 === 國立中正大學 === 機械系 === 87 === Techniques of electronic package face great challenge nowadays due to the current trend of miniturization and fast-to-market for electronic and computer products. Wire bonding, being responsible for electricity and signal delivery, is a critical process in electronic...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47142403748748105535 |