Chemical Mechanical Polish for Planarization of Polycrystalline Silicon
碩士 === 逢甲大學 === 電機工程學系 === 87 === This thesis mainly studies the role of film characteristics in polysilicon chemical mechanical polish, and establishes the mechanism of polysilicon CMP. This thesis consists of two parts. In the first part, the mechanism of undoped p...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/84322491064392056709 |