The Study of Silicon-Surface Damage by Polishing and Related Epitaxial Growth
碩士 === 國立中興大學 === 材料工程學研究所 === 87 === Silicon wafers have been extensively used in the microelectronic and semiconductor industry due to their unique properties and plentiful resources. First part of this work studies the effect of surface damage of test wafer by grinding. The other part...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56264016631938020341 |