A Study of the Popcorn Pheonmena for TSOP
碩士 === 國立成功大學 === 工程科學系 === 87 === Abstract One of the main purposes in electronic packaging is to perform the electrical functions , and to protect the circuits and structures inside from its environments. Due to changes in environments, such as humidity, vibration ,tempera...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94751464062522208063 |