The Manufacturing and Properties of Solder Bump with Electroless Ni/Electroplated Ni as the Under Bump Metallurgy
碩士 === 國立成功大學 === 材料科學及工程學系 === 87 === This research aims at the fabrication and properties of solder bump with electroless nickel and electroplated nickel as the under bump metallurgy on Al electrode. In this experiment, Al layer as the conductive layer was deposited with sputtering on 4...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46653374879759425037 |