Die Crack Analysis of an LOC IC Package
碩士 === 國立成功大學 === 機械工程學系 === 87 === Die cracking is one of the crucial issues that influence the reliability of IC. This paper describes the crack on the Silicon die of a LOC packaged DRAM device. There is mismatch in the coefficient of the thermal expansion (CTE) of materials used, so mechanical...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14531098876491756285 |