Characterization of Abrasives on Chemical-Mechanical Polishing Silicon Oxide and Aluminum Thin Films
碩士 === 國立交通大學 === 材料科學與工程系 === 87 === In the integrated circuit (IC) industry, global planarization of the wafer is an important process to achieve 0.35 um linewidths and multilevel interconnections; chemical-mechanical polishing (CMP) is the most effective technology for global planariza...
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| Format: | Others |
| Language: | zh-TW |
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1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00469647459664735271 |