Acousto-elastic study on fracture toughness of wafer bonding silicon-on-insulator
碩士 === 國立交通大學 === 機械工程系 === 87 === The thesis establishes a quantitative method based on acousto-elasticity to determine the fracture toughness of silicon-on-insulators (SOI). SOI technology is being used increasingly in complimentary metal-oxide-semiconductor (CMOS) devices. The SOI util...
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| Format: | Others |
| Language: | zh-TW |
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1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36042179936767591218 |