電子構裝之三維熱應力分析
碩士 === 國立清華大學 === 化學工程學系 === 87 === Numerical stress analysis of electronic packages during temperature cycling was carried out using a thermoelastic finite-element method (FEM). 3D technique was introduced into programming . Through the use of CG(conjugate gradient ) solver and CSR(compr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03045041634730720850 |