Diffusional Kinetics and Interface Migration of the Reaction Layers in the Unleaded Solder Joint
博士 === 國立清華大學 === 材料科學工程學系 === 87 === The development of the microstructure at the solder/metallization on solder/substrate interface significantly affects the mechanical properties of the joint assembly, and the degradation of the mechanical properties of the solder joint is caused by the formation...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1999
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/81968933050324292330 |