Evaluation of the Capability for Ta-N System as a Diffusion Barrier in Copper interconnection
碩士 === 國立清華大學 === 材料科學工程學系 === 87 === Ta-N thin films were deposited on the n type Si(100) substrate by reactive sputtering for potential application of the diffusion barrier layers in Ultra-large-scale integration (ULSI). Barrier films performance is affected by various deposited paramet...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44034069261444986461 |