Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application

碩士 === 國立清華大學 === 電子工程研究所 === 87 === This thesis is dedicated to comprehensive study on etching and stress of the high doping P+ silicon film. We try to use four kinds of anisotropic etching solution to find out the suitable one in etching P+ silicon film. For film roughness and etching selectivity,...

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Main Authors: Jiun-Ren Lai, 賴俊仁
Other Authors: Prof. Ruey-Shing Huang
Format: Others
Language:zh-TW
Published: 1999
Online Access:http://ndltd.ncl.edu.tw/handle/77220602056446718274
id ndltd-TW-087NTHU0428009
record_format oai_dc
spelling ndltd-TW-087NTHU04280092015-10-13T11:46:55Z http://ndltd.ncl.edu.tw/handle/77220602056446718274 Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application 高濃度硼摻雜矽層蝕刻與應力之研究與應用 Jiun-Ren Lai 賴俊仁 碩士 國立清華大學 電子工程研究所 87 This thesis is dedicated to comprehensive study on etching and stress of the high doping P+ silicon film. We try to use four kinds of anisotropic etching solution to find out the suitable one in etching P+ silicon film. For film roughness and etching selectivity, EDP solution has good performances. In addition, we try to use annealing to fabricate low stress and flat beams. We focus on the influence of annealing parameters to uniform stress and gradient stress of the film, discussing what happens to the bending moment of the cantilever beams. Finally, We have used this technology to fabricate a microstructure of "particle filter". Prof. Ruey-Shing Huang 黃瑞星 1999 學位論文 ; thesis 77 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 電子工程研究所 === 87 === This thesis is dedicated to comprehensive study on etching and stress of the high doping P+ silicon film. We try to use four kinds of anisotropic etching solution to find out the suitable one in etching P+ silicon film. For film roughness and etching selectivity, EDP solution has good performances. In addition, we try to use annealing to fabricate low stress and flat beams. We focus on the influence of annealing parameters to uniform stress and gradient stress of the film, discussing what happens to the bending moment of the cantilever beams. Finally, We have used this technology to fabricate a microstructure of "particle filter".
author2 Prof. Ruey-Shing Huang
author_facet Prof. Ruey-Shing Huang
Jiun-Ren Lai
賴俊仁
author Jiun-Ren Lai
賴俊仁
spellingShingle Jiun-Ren Lai
賴俊仁
Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application
author_sort Jiun-Ren Lai
title Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application
title_short Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application
title_full Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application
title_fullStr Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application
title_full_unstemmed Heavily Boron Doped Silicon Layer Etching and Stress for MEMS Application
title_sort heavily boron doped silicon layer etching and stress for mems application
publishDate 1999
url http://ndltd.ncl.edu.tw/handle/77220602056446718274
work_keys_str_mv AT jiunrenlai heavilyborondopedsiliconlayeretchingandstressformemsapplication
AT làijùnrén heavilyborondopedsiliconlayeretchingandstressformemsapplication
AT jiunrenlai gāonóngdùpéngcànzáxìcéngshíkèyǔyīnglìzhīyánjiūyǔyīngyòng
AT làijùnrén gāonóngdùpéngcànzáxìcéngshíkèyǔyīnglìzhīyánjiūyǔyīngyòng
_version_ 1716847635571146752