The surface energy and photoresist adhesion analysis in the priming process
碩士 === 國立臺灣大學 === 化學工程學研究所 === 87 === This thesis mainly discuss the adhesion between photoresist and the substrate through the priming process in semiconductor manufacturing. First, we study the mechanisms of priming process by the surface chemistry analyzer, ESCA, to verify t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87201034282043876498 |