Study on Ultra-fine Abrasive and Slurry of Chemical Mechanical Polishing for Low Dielectric Constant Materials
碩士 === 國立臺灣大學 === 化學研究所 === 87 === "Chemical Mechanical Planarization (CMP)"is the process of smooth and planing aided by chemical as well as mechanical forces and the feasible technique for global planarization of wafer in the integrated circuit (IC) fabrication. Strategies to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24834084853386342754 |