The fabrication of RTCVD reactor and SiGeC module technology
碩士 === 國立臺灣大學 === 電機工程學研究所 === 87 === Due to the increase of wafer diameter to 12” and 18”, the batch process transfers to the integrated cluster tools of single wafer process gradually; hence we design and assemble a system that combines MESC and 200mm rapid thermal processor....
Main Authors: | Y.D.Tseng, 曾揚玳 |
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Other Authors: | C.W.Liu |
Format: | Others |
Language: | zh-TW |
Published: |
1999
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Online Access: | http://ndltd.ncl.edu.tw/handle/40369238559921904341 |
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