The effect of EMC shape on wire sweep and warpage in IC encapsulation
碩士 === 國立臺灣大學 === 機械工程學研究所 === 87 === Ball Grid Array (BGA) has emerged as the package of choice. An explosive growth in the research and development efforts has been witnessed in resent years. PBGA (Plastic BGA) employs resins as encapsulant from economical and productive reasons. A PBGA...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13588287488044166514 |