A study on the Composition ,Flow Behavior and Porperties of Underfilling Epoxy for Flip Chip Encapsulation Application
碩士 === 國立臺灣科技大學 === 纖維及高分子工程研究所 === 87 === In this study the effect of naphthalene structure on Epoxy resin properties were studied ,The thermal properties ,moisture absorption ,flame resistance With Nylon Powder moldified epoxy resin were also investigated. Due to ,the molding...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52475061446568442750 |