Water Conservation and Pollution Prevention in the Wafer Fabrication Industry

• Main Authors: Yen Chia-Hsin, 顏佳新
• Other Authors: Kuo Mao-Sung
• Format: Others
• Language: zh-TW
• Published: 1999
• Online Access: http://ndltd.ncl.edu.tw/handle/82388998838784915310

碩士 === 東海大學 === 環境科學系 === 87 === Manufacturing of semiconductor devices involves the following works: product and process designing, crystal ingot production, wafer manufacturing, chip cutting, inspection, and package. Among these, the wafer manufacturing has the most sophisticated processes and the environmental concerns. The processes of wafer manufacturing involve the followings: oxidation, chemical vapor deposition, physical vapor deposition, growing thin films on the wafer, photolithography, etching, transferring the designed patterns to the thin films, ion implantation or diffusion of dopants to increase the electrical conductivity of the silicone-based wafer. Large quantities of water are required in wafer manufacturing Fab. Most portions are used in ultrapure water for the wafer processes, cooling tower, and scrubbers. Varieties of chemicals have been used in the wafer manufacturing processes and produced many kinds of wastes (such as: volatile organic compounds, perfluorocompounds, acids, bases, fluorides, and arsenics) which may affect adversely on our environmental quality. Since water resources in Taiwan are limited, and the promulgated regulations become more restricted, the wafer manufacturing industries are challenged by considering how to conserve the water and how to treat the pollutants properly. A study on water conservation, chemicals used, pollutants produced, and the treatment for pollutants in wafer manufacturing industries is preliminary investigated and discussed in this thesis. Case studies about water conservation and pollution prevention from two wafer manufacturing Fabs at Hsin-Chu Science-Based Industrial Park were illustrated.