壓電阻應力計之特性分析與電子構裝熱應力量測
碩士 === 中正理工學院 === 電子工程研究所 === 88 === As die size continuously increases in modern IC and the circuit density goes higher, problems due to packaging induced stress become important for modern microelectronic industry. Therefore, engineers need to construct a stress-monitoring tool to evaluate the mag...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03280059365770395991 |