壓電阻應力計之特性分析與電子構裝熱應力量測
碩士 === 中正理工學院 === 電子工程研究所 === 88 === As die size continuously increases in modern IC and the circuit density goes higher, problems due to packaging induced stress become important for modern microelectronic industry. Therefore, engineers need to construct a stress-monitoring tool to evaluate the mag...
Main Author: | 林玉翎 |
---|---|
Other Authors: | 羅本吉吉 |
Format: | Others |
Language: | zh-TW |
Published: |
2000
|
Online Access: | http://ndltd.ncl.edu.tw/handle/03280059365770395991 |
Similar Items
-
高靈敏度壓電阻應力計製程研究與u-BGA構裝應力量測分析
by: Jeng-shian Su, et al.
Published: (2002) -
積體電路構裝後的熱阻及熱應力量測
by: Huang, Zhong Liang, et al.
Published: (1996) -
電子構裝之三維熱應力分析
by: Wang Yu-Ning, et al.
Published: (1999) -
MOSFET微型應力感測元件參數萃取與應力量測應用之研究
by: Tang Chun Pai, et al.
Published: (2008) -
積體電路構裝之熱分析模擬及熱應力分析
by: Deng, Jun Ming, et al.
Published: (1996)