Measurement and Verification Real-Time Moire Method Applied to Ball Grid Array Packaging
碩士 === 國立中正大學 === 機械系 === 88 === As the development of IC package moved toward to a higher power, smaller, thinnner, and higher reliability, numberous advance surface mounting techhnologies are currently under development. The thermal fatigue of elctronic packaging could depend on a number of parame...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85605969231860288738 |