Development for Positionability Evaluation
碩士 === 義守大學 === 管理科學研究所 === 88 === Abstract Wire bonder is the key equipment in IC assembly industry. The main purpose of wire bonding is to bond gold wire at bond pads of crystal and lead fingers of leadframe for circuit connection. Generally, the bonding process includes "working a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81287519104702413244 |