| Summary: | 碩士 === 義守大學 === 管理科學研究所 === 88 === Abstract
Wire bonder is the key equipment in IC assembly industry. The main purpose of wire bonding is to bond gold wire at bond pads of crystal and lead fingers of leadframe for circuit connection. Generally, the bonding process includes "working area positioning", "bonding distance teaching", "leadframe loading / unloading","pattern recognition" and "automatic wire bonding" ,...etc. In nowadays IC business products with characters of high pin count and fine pitch have become the main stream of market. This market trend leads wire bonder to be equipped with more reliable image pattern recognition system and better wire bonding precision and accuracy which have become the major considerations in terms of manufacturers decision marking on the selection of suitable wire bonders.
In fact, the modern wire bonder are all designed automatically. However, there are no much information regarding the evaluation of wire bonding precision and accuracy. Unless the wire bonder was observed in poor or inaccurate bonding condition obviously in shopfloor daily practice. Otherwise the IC manufacturers could not foresee when the precision and accuracy of wire bonder will be out of control. Therefore, to develop a well defined evaluation procedure would be very helpful for IC manufacturers regarding the diagnose of wire bonding accuracy and precision in their routine operation for real time boding quality management. This study is mainly focused on the development of this kind of evaluation procedure and hope it would be equipped along with wire bonder for auto diagnosis someday in the near future aiming at bonding capability upgrade accordingly.
|
|---|
