Thermal strain analysis of SuperBGA by moire interferometry
碩士 === 國立成功大學 === 工程科學系 === 88 === When the temperature of electronic package components circulate repeatedly, they cause the horizontal and vertical displacement between components and I/O along with the difference of coefficient of thermal expansion(CTE), solder joints, encapsulate resi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45976222926498030750 |