| Summary: | 碩士 === 國立成功大學 === 工程科學系 === 88 === When the temperature of electronic package components circulate repeatedly, they cause the horizontal and vertical displacement between components and I/O along with the difference of coefficient of thermal expansion(CTE), solder joints, encapsulate resin, heat sink and substrate material. Due to this reason, the materials are under the circumstance of fatigue and warpage. Therefore, the components place on the surface of touching point, they lost the operation function because of the destructive fatigue. This research based on moiré interfermety as an experiment to measure the new Super BGA in package style and compare with PBGA on understanding the difference of CTE among electronic packages. They produce fatigue failure. Beside, the result of this experiment will provide the further data to IC designer engineer on the reliability analysis for the best solution in convenience and reduce the product cost.
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