The Reliability Analysis of Solder Bump
碩士 === 國立成功大學 === 工程科學系 === 88 === Abstract In this thesis , attention is focused on the thermo-mechanical modeling in area array fine-pitched ball grid array chip scale package（CSP）.The effects of natural and forced convection during chip power cycling are studied under the constra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16364382682022641073 |