Investigations on the Anisotropically Conductive Adhesive for Flip-Chip Technology
碩士 === 國立成功大學 === 材料科學及工程學系 === 88 === This work focus on the process of flip-chip technology using anisotropically conductive adhesive(ACA). A water pump was applied to produce a flux remove the bubble and thus obtain a smooth electroless deposition. ACA material has been investigated by...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95566415443611010109 |