Adhesion Strength and Interfacial Reaction between Sn-Zn System Lead-free Solders and Cu Substrate
博士 === 國立成功大學 === 材料科學及工程學系 === 88 === The effects of process parameters such as flux, dipping parameters and the heat-treatment on the soldering behaviors and adhesion strength of the eutectic 91Sn-9Zn, near-eutectic 86Sn-9Zn-5In, Sn-Zn-Al solders hot-dipped on Cu substrate were investigated. The f...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06769290190909834009 |