Thermal Stress Analysis of Solder Ball for Flip-Chip Packaging Assemblies under Different Process
碩士 === 國立成功大學 === 機械工程學系 === 88 === In the present studies, the finite element software ABAQUS was used to study the solder joints of the flip-chip packaging assembly, a non-linear finite element framework was established for processing mechanics modeling of flip-chip packaging assemblies and releva...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98934862950152811932 |