Thermal and Warpage Analysis for TSOP-IC Packages
碩士 === 國立成功大學 === 機械工程學系 === 88 === The increase in circuit density and decrease in volume size in IC packages have emerged as an inevitable trend in recent years. As a result, the heat dissipation problem becomes a critical issue for IC packaging applications. The effect of geometric shapes and pac...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70913701301383338679 |