Theoretical analysis and experiments for the tribological performances of slurry flow with micro particles in chemical mechanical polishing for wafers
碩士 === 國立成功大學 === 機械工程學系 === 88 === This study is to establish a tribological model for Chemical Mechanical Polishing (CMP), which is carried out in order to understand the effects to friction coefficients, removal rate of silicon-oxide film, and non-uniformity of CMP caused by different particle si...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06197849751148659935 |