Study of Hybrid-Organic-Siloxane-Polymer (HOSP) - A Low Dielectric Constant Material for ULSI Applications
碩士 === 國立交通大學 === 電子工程系 === 88 === Interconnect delay is a performance-limiting factor for ULSI circuits when feature size is scaled to the deep submicron region. Using low dielectric constant materials for the interlayer insulator is an effective way to solve this problem. We have studie...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62997705121535901008 |