Electrical Reliability Analyses of Integrating Low-K CVD Dielectrics with Cu Metallization
碩士 === 國立交通大學 === 電子工程系 === 88 === This thesis mainly investigates the thermal stability as well as the electrical reliability associated with the integration of Cu and two species of SiO2-based low-K CVD dielectric materials：fluorinated silicate glass (FSG, K=3.5-3.7) and organosilicate...
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| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12319684158570151591 |