The Study of Stratified Underfills Process In Flip Chip Technology
碩士 === 國立交通大學 === 電子物理系 === 88 === The feasibility of solder columns with stratified underfill technology is explored in this study. In traditional flip chip technology, solder bumps are first deposited on the die, assembled with substrate and then filled with a underfill. However, in the bumping...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11158673960741529791 |